Auto-Report Add-On for AWR MWO

Cathegories:

                    EDA Automations, AWR Add-On, Documentation for MWO/VSS

Main Features:

- Easy documenation of MWO Project

- Includes System Diagrams, Schematics, EM Structures, Graphs, 2D, 3D Views, Currents, Radiation patterns

- Output to MS Word or Power Point

Ongoing features:

- CAM data generation

   - BOM (Bill of Materials) - list of used components with orderable part numbers

   - Pick&Place - information for pick and place mashine

- Complane tables with Result vs. Goal shows design status vs specification

Go to download

EM-Based Spice Models

Cathegories: CAD, Simulation models 

High precision models based on EM Simulation.

Key features:

• - Compact size
• - Wide frequency range 
• - Physical nature of extracted circuit
• - Wide impedance range
• - No Source/Sync issues, as in some Spice extraction tools

Possible applications:

• Signal Integrity analysis​
• Models of library components
• Analog spice simulation, time and frequency domain
• IBIS and spice models blocks
• PCB, Laminate, LTCC and other package type extractions

See  EM-SPICE Models page

HF Layout Integration

AG RF Engineering & Consulting offers new service to their customers - reference layout for HF and Digital high-speed signal components.

In this way we solve HF integration problem of the component, eliminating couplings and matching issues on PCB.

Layout has parameterization to match custome requirements. It allows also the customer without significant HF knowledge use HF blocks in his layout. Some final optmization on the board and SI analysis report can be done on request.

Key features:

• HF Optimized layout
• Parameterized layout to match stack-up
• IPC footprint
• If exist include simulation model
• Farther analysis for different scenarion possible
• Avilable for diffeent tools

Contact us to learn more

RF Designs

Low-Noise Amplifiers, Filters, Antennas (passive and active) and antenna Systems, Balance circuits, etc.

Integration of components on PCB

Technologies: Leadframe Package technology, LTCC, Laminate, PCB

Applications: 3G,4G,5G, Radar (24GHz), WiFi, DVBT and SAT TV, GPS

• Design Flow extensions for AWR MWO, AutoCAD, Zuken and Ansys HFSS
• AWR Process Design Kits (PDKs) for PCB, LTCC, Laminate
• Component Libraries for AWR MWO
• Symbols, Footprints and RF Reference Layouts for MMIC LNAs, Switches, etc. (Cadence, Mentor, AWR MWO, ADS, Eagle, etc.)

Design services

• RF System and Circuits design
• Design Prototyping
• Electric Models Extraction
• Signal Integrity, Power Integrity and EMC Analysis
• High-Speed Digital design
• 3D Models
• Thermal and mechanic simulation